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E2E0018-27-Y4 Semiconductor
Semiconductor MSM6502B/6512
Low-power and Built-in LCD Driver 4-Bit Microcontroller
This version: Jan. 1998 MSM6502B/6512 Previous version: Mar. 1996
GENERAL DESCRIPTION
The MSM6502B/6512 is a low-power, 4-bit microcontroller implemented in complementary metal-oxide semiconductor technology. The device is ideally suited to battery-powered systems such as watches and game machines because it can directly drive LCDs with up to 108 picture elements.
FEATURES
* ROM * RAM * Number of instructions * Clock oscillation * Cycle time * Timer interrupt * I/O port Input-output port Input port * LCD drive * Buzzer * Interrupt * Stack : : : : : : : : : : : : 2000 words 8 bits 128 words 4 bits 68 Crystal 32.768 kHz 91.5 ms Dual (16,128 Hz)
2 ports 4 bits 1 port 4 bits 108 (4 27) picture elements 2000/1000/512 Hz/Soft Three sources (external; two timer sources) Nesting RAM Stack pointer = 7 bits * Power down : Halt mode available * Operating power supply voltage : 2.4 V to 3.6 V * Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM6502B-GS-K, MSM6512-GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM6502B-GS-2K, MSM6512-GS-2K) indicates the code number.
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Semiconductor
BLOCK DIAGRAM
INSTRUC- TION DECODER
IH R L
R O M D A T A
PROGRAM MEMORY ROM 2000 8bits
ACC 4bits C H
8bits
ALU L
H
PCR ML
11bits 11bits H 4bits BUS L 4bits 8bits 8bits
H DP L H SP L H IDR L H PC M L
7bits
8bits
BZ CONT
I INT. TBF V A CONTROL
R/W f TBC 12bits
DATA MEMORY RAM 128 4bits
P2 4bits
P1 4bits
P0 4bits
2
OSC Timing Generator
LCD Driver
MSM6502B/6512
P2.0 to P2.3
P1.0 to P1.3
P0.0 to P0.3
BZ/BZ OSC1 4 3 2 1 OSC0 RESET
INT
COM1 - 4
SEG0 - 26
VDD GND
TEST
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MSM6502B/6512
PIN CONFIGURATION (TOP VIEW)
SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 VDD SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 56 55 54 53 52 51 50 49 48 47 46 45 44 43
P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 BZ BZ
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
42 41 40 39 38 37 36 35 34 33 32 31 30 29
SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0
RESET INT TEST1 TEST2 TEST3 TEST4 VDD OSC0 OSC1 GND COM1 COM2 COM3 COM4
56-Pin Plastic QFP
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Semiconductor
MSM6502B/6512
PIN DESCRIPTIONS
Pin 24 21, 49 22 23 1 to 4 5 to 8 Symbol GND VDD OSC0 OSC1 P0.0 to P0.3 P1.0 to P1.3 Ground pin Power supply pins Crystal OSC input, internal clock input Crystal OSC input, internal clock output Pseudo-bidirectional ports for 4-bit parallel I/O. To input data from these ports, it is necessary to write "1" beforehand. The port to be selected is specified by the L register. The register contents and the corresponding specified ports are listed below. Content of L Register 0, 8 1, 9 2, 0AH 3, 0BH 4, 0CH 5, 0DH 6, 7, OEH, OFH Note: P3, P4, and P5 are internal ports. 9 to 12 16 15 P2.0 to P2.3 INT RESET Input port for 4-bit parallel input with no latching function. Input pin to request an interrupt from the external circuit. The input flag is set at the falling edge of the input signal. The reset mode starts after "0" is input to the RESET pin for more than 2 machine cycles. The reset signal has priority over all of other signals and performs the following operations automatically: (1) Resets all bits of the PC (program counter) to"0". (2) Sets all bits of the parallel I/O ports (P0.0 to P1.3) to "1" (3) Resets the internal register (H, L, ACC, C, P3, P4, P5). (4) Resets the skip flag. (5) Resets all bits of the time base counter (TBC). (6) Resets the interrupt request flag (IRQF). (7) Resets the interrupt enable flag (EIF). (8) Resets the master interrupt enable flag (MEIF). (9) Sets all bits of the stack pointer (SP) to "1" . (10) Initializes the segment and common outputs. (11) Sets all bits of the index register (IDR) to "1". Since the RESET pin is pulled up to VDD by an internal resistor (800 kW), it is possible to achieve power ON reset by connecting it with an external capacitor. Port Specified P0 P1 P2 P3 P4 P5 No designation Description
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Semiconductor
MSM6502B/6512
PIN DESCRIPTIONS (Continued)
Pin 29 to 48 50 to 56 25 to 28 COM 1 to 4 Symbol LCD Drive Pins SEG 0 to 26 Description A special AC waveform designed to comply with liquid-crystal properties is required for liquid-crystal-drive purposes. The MSM6502B/6512 is equipped with a 1/4 duty, 1/3 bias liquid-crystal-drive circuit with four common output ports and 27 segments, to enable displays of up to 108 picture elements. On/off selection of picture elements involves writing "0" or "1" to the corresponding bits in the RAM 00H to 1AH display area, and subsequent automatic hardware controlled display. The frame frequency is 64 Hz. 13,14 BZ/BZ BZ and BZ are used in the generation of alarms and other sounds. The selectable frequencies include three hardware frequencies (TBC output) of 512, 1024, and 2048 Hz, and a software type based on P5.0 data. These frequencies are selected at P3. When one of the hardware frequencies is selected by P3, output of that frequency is continuous. But selection of the software type results in output of the P5.0 contents to generate a melody by program.
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Semiconductor
MSM6502B/6512
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Output Voltage Power Dissipation Storage Temperature Symbol VDD VI VO PD TSTG Ta=25C per package -- Ta=25C Condition Rating -0.3 to +7 -0.3 to VDD -0.3 to VDD 200 -55 to +150 Unit V V V mW C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Symbol VDD Top Condition fOSC32.768 kHz -- Range 2.4 to 3.6 -20 to +70 Unit V C
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Semiconductor
MSM6502B/6512
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=3 V, Ta=-20 to +70C) Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage (*1) "L" Output Voltage (*2) Symbol VIH VIL VOH VOL V3 V2 V1 V0 OSC0 Input Current Input Current (*4) Input Current (*5) Input Current (*6) P0, P1 "H" Output Current IIH/IIL IIH/IIL IIH/IIL IIH/IIL IOH IDD Condition -- -- IO=-1.0 mA IO=1.0 mA MSM6502B MSM6512 MSM6502B MSM6512 MSM6502B MSM6512 MSM6502B MSM6512 IO=-5 mA IO=-2 mA IO=2 mA IO=0.5 mA IO=2 mA IO=0.5 mA IO=5 mA IO=2 mA Min. 2.6 -- 2.0 -- 2.8 1.8 0.8 0.0 -- -- -- -- -- -- -- -- -- -- -- -- Typ. -- -- -- -- -- -- -- -- -- -- -- -- -- 45 30 30 12 15 5 -- Max. -- 0.4 -- 1.0 3.0 2.2 1.2 0.2 2/-2 1/-10 1000/-1 1/-10 -50 70 55 40 mA 25 25 15 10 mA sec Unit V V V V V V V V mA mA mA mA mA mA
LCD Drive Output Voltage (*3)
VI=VDD/VI=0 V VI=VDD/VI=0 V VI=VDD/VI=0 V VI=VDD/VI=0 V VO=0 V MSM6502B fOSC=32.768 MSM6512 kHz at no load MSM6502B fOSC=32.768 kHz at HLT MSM6512 execution MSM6502B MSM6512 -- Static
Current Consumption
IDDHLT
IDDS Oscillation Start Time TOSC
*1 Applied to BZ, BZ *2 Applied to BZ, BZ, P0, P1 *3 Applied to COM1-4, SEG0-26
V3 V2 V1 V0
*4 Applied to RESET, INT *5 Applied to P2 (When input is disabled) *6 Applied to P2 (When input is enabled)
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Semiconductor Switching Characteristics
MSM6502B/6512
(VDD=3 V, Ta=-20 to +70C) Parameter Clock (OSC0) Pulse Width Cycle Time P0 P1 Data Valid Time P2 P0 P1 Data Invalid Time P2 P0 P1 Data Delay Time tDDS CL=50 pF -- -- (*4) ms tDIV -- -- -- (*3) ms tDV -- (*2) -- -- ms Symbol tfW tCY Condition -- -- Min. 15 (*1) Typ. -- -- Max. -- -- Unit ms ms
*1 *2 *3 *4
tCY=3 1/fOSC tDV=1/2 1/fOSC tDIV=1 1/fOSC + 10 ms tDDS=5/2 1/fOSC + 15 ms
1MC tCY OSC0 tfW P0 P1 Input mode P2 tfW VALID tDV OLD DATA tDDS NEW DATA INVALID
INVALID tDIV
P0 Output mode P1
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Semiconductor Operating Characteristics (MSM6502B) High-level Output Current (IOH) - Output Voltage (VOH)
-5 -4 IOH (mA) -3 -2 -1 0
(COM, SEG pins)
MSM6502B/6512
Low-level Output Current (IOL) - Output Voltage (VOL)
10 9 8 7 6 5 4 3 2 1 0 (VDD=3 V, Ta=25C)
(VDD=3 V, Ta=25C)
BZ, BZ pins
IOL (mA)
(P0, P1 pins) (BZ, BZ pins)
COM, SEG pins
(P0, P1 pins)
0 1 2 3 4 5 6 7 8 9 10 VOH (V)
0 1 2 3 4 5 6 7 8 9 10 VOL (V)
Middle-level Output Current (I1, I2) - Output Voltage (V1, V2)
25 20 15 10 2 0 -5 -10 -15 -20 -25 (VDD=3 V, Ta=25C)
Current Consumption (IDD) - Power Supply Voltage (VDD)
10m 5m 1m 500m (Ta=25C, no load)
V1 V2
I1, I2 (mA)
(COM, SEG pins)
100m 50m IDD (A) 0 1 2 3 4 5 6 7 8 9 10 V1, V2 (V) 10m 5m 1m 500n 100n
fOSC=32.768 kHz 0Hz
0 1 2 3 4 5 6 7 8 9 10 VDD (V)
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Semiconductor Operating Characteristics (MSM6512) High-level Output Current (IOH) - Output Voltage (VOH)
-5 -4 (VDD=3 V, Ta=25C)
MSM6502B/6512
Low-level Output Current (IOL) - Output Voltage (VOL)
10 9 8 7 6 5 4 3 2 1 0 (VDD=3 V, Ta=25C)
IOH (mA)
-3 -2 -1 0
(BZ, BZ pins)
IOL (mA)
(COM, SEG pins)
(P0, P1 pins) (BZ, BZ pins)
(COM, SEG pins)
(P0, P1 pins)
0 1 2 3 4 5 6 7 8 9 10 VOH (V)
0 1 2 3 4 5 6 7 8 9 10 VOL (V)
Middle-level Output Current (I1, I2) - Output Voltage (V1, V2)
25 20 15 10 2 0 -5 -10 -15 -20 -25 (VDD=3 V, Ta=25C)
Current Consumption (IDD) - Power Supply Voltage (VDD)
10m 5m 1m 500m (Ta=25C, no load)
V1 V2
I1, I2 (mA)
(COM, SEG pins)
100m 50m
fOSC=32.768 kHz 0Hz
IDD (A)
0 1 2 3 4 5 6 7 8 9 10 V1, V2 (V)
10m 5m 1m 500n 100n
0 1 2 3 4 5 6 7 8 9 10 VDD (V)
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PACKAGE DIMENSIONS
(Unit : mm)
QFP56-P-910-0.65-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM6502B/6512
(Unit : mm)
QFP56-P-910-0.65-2K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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